MINGCHENG GROUP LIMITED
Customer First, Dedication, Innovation. MC Silicone Professional Mould Making & Casting Materials Supplier
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Description
Silicone compound is supplied as a two-component addition cure system. It consists of Part A and Part B. The component A is white and component B is black for easy identification and inspection of complete mixing.(colors can be adjusted as per customer requirement.) When the components are thoroughly mixed in a 1:1 ratio by weight or volume, the liquid mixture cures to a flexible elastomer, which is suited for electrical/electronic potting and encapsulating applications.
Applications
Silicone is a general purpose compound suited for adhesive and coating. This cost-effective silicone can be used in a variety of electronic potting applications including the adhesive and coating for solar power, HID, LCD displayers, circuit board and electronic components, etc.
Features
Silicone compound has a excellent electrical property features in resistant to temperature, corrosion, radiation, insulation, waterproof, damp proofing, shock resistance, thermal conducting, inflaming retarding and weather ability, etc. It can be long-term used under -50℃～200℃.
Typical properties
| Item No.: | RTV160A/B |
| Appearance(A/B) | White/Grey liquid |
| Viscosity(A/B,Mpa.s) | 3700±2000 |
| Mix ratio (A/B) | 1:1 |
| Pot life after curing(25℃,min) | 30-40 |
| Curing time (hrs) | 2-4 |
| Thermal conductivity(W/m·K)(A/B) | ≥0.60 |
| Durometer Hardness(JIS A0) | 56 |
| Volume resistivity(Ω·cm) | 7X10 14 |
| Dielectric breakdown voltage(KV/mm) | ≥20 |
| Flammability classification | UL-94 V-0 |
| Shrinkage % | 0.01 |
Thermal expansion properties
The coefficient of thermal expansion ranging of silicone compound is 5.9-7.9 x 10-4/°C. The coefficient of linear thermal expansion is about 1/3 of the coefficient of volume thermal expansion; it can be used for the overall linear thermal expansion calculation of rubber parts under a certain limits of temperature.
Curing time
The following cure schedules may be used as a guideline; however, larger masses may require longer periods of time to reach temperature.
24 hours at 23-25℃
4-6 hours at 50℃
1-2 hours at 100℃
Faster if needed
25-30 mins at 60℃
18 mins at 70℃
5 mins at 80℃
Using Instructions
Silicone compound part A and Part B should be thoroughly mixed at a 1:1 ratio (weight or volume) before using. Pour into the electronic components after vacuum de-airing. Silicone compound may be cured at room temperature or accelerated with heat.
Precautions
Packing and Storage